Importance

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Abstract

Methods and systems for a chaser pellet in a semiconductor mold process are disclosed and may include a semiconductor package comprising semiconductor die coupled to a packaging substrate where the packaging substrate and the coupled semiconductor die may be placed in a mold chase. A chaser pellet may be placed on a target pellet comprising low alpha epoxy mold compound (EMC) in a pellet chamber coupled to the mold chase via a runner. Heat may be applied to the pellet chamber to melt the target pellet. Pressure may be applied to the chaser pellet to force EPM from the molten target pellet through the runner to the mold chase. The die may be encapsulated with the epoxy mold compound from the molten target pellet. Passive devices may be coupled to the semiconductor package and may be encapsulated by the EPM from the molten target pellet.

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First Claim