ELECTRONIC DEVICE, SYSTEM PACKAGE MODULE AND METHOD OF MANUFACTURING SYSTEM PACKAGE MODULE
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United States of America Patent
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Issued Date -
May 8, 2014
app pub date -
Mar 11, 2013
filing date -
Nov 7, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A system in package (SiP) module includes a first circuit board assembly, a second circuit board assembly and a plurality of metallic pillars. The first circuit board assembly has a first top surface, a first bottom surface and a plurality of pads mounted on the first bottom surface. The second circuit board assembly has a second top surface, a second bottom surface and a plurality of second pads mounted on the second top surface. The metallic pillars are disposed between the first bottom surface and the second top surface. The metallic pillars electrically connect the first pad and the second pad.
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