ANALYTIC CONTINUATIONS TO THE CONTINUUM LIMIT IN NUMERICAL SIMULATIONS OF WAFER RESPONSE

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United States of America Patent

APP PUB NO 20140136164A1
SERIAL NO

13834753

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Abstract

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Simulations of metrology measurements of a structure may be performed on a metrology model of the structure at two or more different truncation orders up to a maximum truncation order. The simulation results can be fitted to a function of a form that reflects the fact that a truncation order of infinity is an analytic point that admits Taylor series expansion. The function can be extrapolated to a truncation order approaching infinity limit to obtain a high fidelity result. Fitted parameters for the function can be obtained using simulation results for two or more truncation orders that are less than the maximum truncation by fitting the simulation results for the truncation orders to the function. A simulated metrology signal can be obtained by performing a simulation using an optimized truncation order that is less than the maximum truncation order, the function and the one or more fitted parameters.

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Patent Owner(s)

Patent OwnerAddress
KLA-TENCOR CORPORATIONONE TECHNOLOGY DRIVE MILPITAS CA 95035

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bringoltz, Barak Rishon Le Tzion, IL 28 397

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