METHOD AND APPARATUS FOR PROCESSING A WORKPIECE AND AN ARTICLE FORMED THEREBY
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United States of America Patent
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Issued Date -
May 22, 2014
app pub date -
Nov 14, 2013
filing date -
Nov 16, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A manufacturing process is applicable to singulating die from a substrate, where the substrate has a layer distinguishable from the substrate by a mechanical property such as brittleness. The process can include providing a workpiece including a substrate and a layer disposed on a first surface, modifying the mechanical property such as by compression, deforming a region of the substrate proximate to the portion of the layer having the modified mechanical property; and fracturing the portion of the layer at a location proximate to the deformed region of the substrate. Also, the process can include propagating a crack through a region of the substrate on a line along the modified portion of the layer. A die formed in this manner is also provided.
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