METHOD FOR PROVIDING ORGANIC RESIST ADHESION TO A COPPER OR COPPER ALLOY SURFACE
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United States of America Patent
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Issued Date -
May 22, 2014
app pub date -
Jun 29, 2012
filing date -
Jul 7, 2011
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a method for increasing the adhesion of organic resist materials on copper or copper alloy surfaces. The copper or copper alloy surface is contacted with an aqueous adhesion promoting solution comprising at least one organic acid, a peroxide compound and optionally one or more substances selected from the group consisting of urea, derivatives thereof and water-soluble polymers.
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