CIRCUIT BOARD, PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
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United States of America Patent
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Issued Date -
May 29, 2014
app pub date -
Nov 28, 2013
filing date -
Nov 28, 2012
priority date (Note) -
Abandoned
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Abstract
A circuit board includes at least one core substrate, at least one insulating layer and at least one dielectric sheet. An opening is defined in the insulating layer corresponding to the core substrate. An area of cross-section of the opening is larger than that of the core substrate. The core substrate is received in the opening. The dielectric sheet is positioned on one side surface of the core substrate and the insulating layer. A cavity is defined in the circuit board. A number of pads of the core substrate are exposed via the cavity. The present disclosure also provides a method for manufacturing the circuit board and package structure.
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