HEAT SINK

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20140151010A1
SERIAL NO

13692648

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A heat sink includes a base having a structure side and an opposite environmental side. The structure side of the base is configured to thermally communicate with a structure for absorbing heat from the structure. A cooling fin extends a height outwardly from the environmental side of the base. The cooling fin extends a cord length along the base from a leading edge to a trailing edge of the cooling fin. The cooling fin includes the cross-sectional shape of an airfoil along at least a portion of the height of the cooling fin to increase the velocity of a flow of air along the cord length of the cooling fin.

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Patent Owner(s)

Patent OwnerAddress
TYCO ELECTRONICS CORPORATION1050 WESTLAKE DRIVE BERWYN PA 19312

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nichols, Robert Paul Vacaville, US 30 518

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