METHODS OF USING POLISHED SILICON WAFER STRIPS FOR EUV HOMOGENIZER
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United States of America Patent
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Issued Date -
Jun 5, 2014
app pub date -
Nov 18, 2013
filing date -
Nov 30, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention is a light homogenizer or light tunnel with highly reflective sides that enable the focusing of EUV illumination. The sides of the homogenizer are cut from a highly polished silicon wafer. The wafer is coated with a reflective coating before the strips are cut from the wafer. The invention also includes a method for flattening the strips and applying a backing to the strips enabling easier manipulation of the strips during assembly and use.
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