Importance

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Abstract

A semiconductor package includes: a first wiring substrate; a first spacer on the first wiring substrate, wherein the first spacer has a rectangular shape; a second spacer on the first wiring substrate to be separated from the first spacer, wherein the second spacer has a rectangular shape; a second wiring substrate on the first spacer and the second spacer and having a first surface and a second surface which is opposite to the first surface, wherein the second wiring substrate has opposed sides; a first semiconductor chip on the first surface of the second wiring substrate; and a second semiconductor chip on the second surface of the second wiring substrate to be disposed between the first spacer and the second spacer. The opposed long sides of the first and second spacers are substantially parallel with the opposed sides of the second wiring substrate.

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First Claim