Integrated circuits and systems and methods for producing the same
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United States of America Patent
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Feb 24, 2015
Grant Date -
Jun 5, 2014
app pub date -
Nov 30, 2012
filing date -
Nov 30, 2012
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Abstract
Three dimensional integrated circuits including semiconductive organic materials are described. In some embodiments, the three dimensional integrated circuits include one or more electronic components that include a semiconductive region formed of one or more semiconductive organic materials. The electronic components of the three dimensional integrated circuits may also include insulating regions formed from organic insulating materials, and conductive regions form from conductive materials. The three dimensional integrated circuits may be formed by an additive manufacturing process such as three dimensional printing. Apparatus and methods for producing and testing three dimensional integrated circuits are also described.
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