Pad Conditioning and Wafer Retaining Ring and Manufacturing Method Thereof
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United States of America Patent
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Issued Date -
Jun 5, 2014
app pub date -
Nov 29, 2013
filing date -
Nov 30, 2012
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Abstract
The present invention relates to a wafer retaining ring used in a chemical mechanical polishing process (CMP) for semiconductor device manufacturing, and in particular, to a pad conditioning and wafer retaining ring designed to prevent a wafer from slipping during the CMP process and, simultaneously condition a pad uniformly, and to a manufacturing method thereof.
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