METHOD OF MAKING HYBRID WIRING BOARD WITH BUILT-IN STOPPER, INTERPOSER AND BUILD-UP CIRCUITRY
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United States of America Patent
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Issued Date -
Jun 12, 2014
app pub date -
Jan 30, 2013
filing date -
Aug 14, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to a method of making a hybrid wiring board with built-in stopper and interposer. In accordance with one preferred embodiment of the present invention, the method includes: forming a stopper on a dielectric layer; mounting an interposer on the dielectric layer using the stopper as a placement guide for the interposer; attaching a stiffener to the dielectric layer; and forming a build-up circuitry that covers the interposer, the stopper and the stiffener and provides signal routing for the interposer. Accordingly, the stopper can accurately confine the placement location of the interposer and avoid the electrical connection failure between the interposer and the build-up circuitry.
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