ELECTROLYTIC COPPER PLATING SOLUTION FOR FILLING FOR FORMING MICROWIRING OF COPPER FOR ULSI

Number of patents in Portfolio can not be more than 2000

United States of America Patent

SERIAL NO

14101457

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

An electrolytic copper plating solution for filling for forming microwiring for ULSI, is characterized in that it has a pH of from 1.8 to 3.0. The electrolytic copper plating solution preferably contains a saturated carboxylic acid having from 1 to 4 carbon atoms at a concentration from 0.01 to 2.0 mol/L.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
JX NIPPON MINING & METALS CORPORATION1-2 SHIROGANE-CHO 1-CHOME HITACHI-SHI IBARAKI IL 60606

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AIBA, Akihiro Kitaibaraki-shi, JP 16 71
SEKIGUCHI, Junnosuke Kitaibaraki-shi, JP 28 106
TAKAHASHI, Hirofumi Kitaibaraki-shi, JP 39 293

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation