SEMICONDUCTOR ASSEMBLY

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United States of America Patent

APP PUB NO 20140159231A1
SERIAL NO

13637140

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor assembly that may enhance dissipation of heat. The assembly includes a first die of a first material and defining a first passage. A second material, such as silicon carbide, diamond, or carbon nanotube, having a higher heat conductivity than the first material is disposed in the center of the first passage. An electronic component, which may be, for example, another die or a printed wiring board, is adjacent to the first die, is predominantly of a third material, and defines a first opening. A fourth material having a higher heat conductivity than the third material is disposed in the center of the first opening. The first opening is in alignment with the first passage, and may provide for heat transfer with a chimney effect between the materials of relatively high heat conductivity. A mold including a high heat conductivity material may also be provided.

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Patent Owner(s)

Patent OwnerAddress
SONY MOBILE COMMUNICATIONS ABNYA VATTENTORNET LUND 221 88

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lundberg, Nils Magnus Hollviken, SE 2 7

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