Importance

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Abstract

Methods and systems for semiconductor packaging are disclosed and may include bonding a semiconductor wafer to a support structure, separating the wafer into discrete die, removing the die from the support structure, and attaching at least a subset of the die to a second support structure. Mold material may be placed in voids between the die utilizing a compression molding process, thereby generating a molded wafer, which may be demounted before depositing redistribution lines on the die and the mold material. Conductive balls may be placed on the redistribution lines before separating into molded packages. The molded wafer may be planarized utilizing a post-mold cure on a heated vacuum chuck after removing it from the second support structure. The redistribution lines may be electrically isolated utilizing polymer layers. The conductive balls may be placed on copper redistribution lines with a surface oxide layer at least 20 angstroms thick.

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First Claim