METHOD AND APPARATUS FOR REDUCING STRESS ON MOUNTED ELECTRONIC DEVICES
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United States of America Patent
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Issued Date -
Jun 19, 2014
app pub date -
Dec 12, 2013
filing date -
Dec 18, 2012
priority date (Note) -
Abandoned
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Abstract
A continuous substrate including a first portion with a plurality of electronic components, and at least one strain relief area located proximate a fastening location, wherein the at least one strain relief area is located between the first portion and the fastening location.
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