Method of Forming Substrate
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United States of America Patent
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N/A
Issued Date -
Jun 19, 2014
app pub date -
Dec 13, 2013
filing date -
Dec 13, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of forming a substrate is provided, which includes steps of providing a metal plate having a first surface and a second surface; forming a plurality of recesses on the first surface of the metal plate by using laser cutting technique; filling the plurality of recesses with an insulating material; removing a part of the metal plate in a direction of from the second surface to the first surface, so that two ends of the insulating material are exposed, and a substrate body is formed by a conductor portion formed by the remaining part of the metal plate and an insulating portion formed by the insulating material; and forming a circuit layer on a first surface of the substrate body and a circuit layer on a second surface of the substrate body is provided. Thus, the two circuit layers are electrically connected by the conductor portion that also provides a heat dissipation path and are separated by the insulating portion.
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