Printed wiring board, printed circuit board, and method for manufacturing printed circuit board
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United States of America Patent
Stats
-
Oct 18, 2016
Grant Date -
Jun 26, 2014
app pub date -
Dec 11, 2013
filing date -
Dec 21, 2012
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A printed wiring board has a heat transfer pattern facing a heat sink of an electronic component, on a first surface layer on which the electronic component having the heat sink is mounted. The printed wiring board has a through hole conductor formed in a through hole penetrating the printed wiring board corresponding to the heat transfer pattern, and thermally connected to the heat transfer pattern. The heat transfer pattern has a plurality of connecting lands exposed so as to be connectable to the heat sink of the electronic component by solder while being divided by a solder resist. The plurality of the connecting lands include lands adjacent to the through holes, and lands not adjacent to the through holes. The heat dissipation of the electronic component is enhanced while enhancing the connectability of the heat transfer pattern with the heat sink of the electronic component, at being mounted.
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