METHOD FOR SLEEVE RETAINING A SOLDER MATERIAL ONTO A TERMINAL UNIT
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United States of America Patent
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Issued Date -
Jun 26, 2014
app pub date -
Dec 21, 2012
filing date -
Dec 21, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present disclosure relates to a method of sleeve retaining a solder material onto a terminal unit comprises of steps. In order to achieve the steps, a structure is also disclosed which comprises: a terminal unit and a solder material wherein the terminal unit possess a fixing portion while the solder material forms a sleeve which corresponds to the terminal unit, therefore enabling the sleeve retaining of the solder material. By means of sleevingly retain as described above, the assembly of the terminal unit and the solder material can be further stabilized.
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