Packaging structure
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Dec 23, 2014
Issued Date -
N/A
app pub date -
Dec 20, 2012
filing date -
Dec 20, 2012
priority date (Note) -
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Abstract
A packaging structure is provided. The packaging structure includes first and second chips, at least one surface of each of the first and second chips being an active surface and a common chip to which at least one of the first and second chips is electrically interconnected. The respective active surfaces of the first and second chips are directly electrically interconnected to one another in a face-to-face arrangement and are oriented transversely with respect to the common chip.
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