Surface modified TSV structure and methods thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9312175
APP PUB NO 20140175654A1
SERIAL NO

13722365

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Abstract

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Microelectronic elements and methods of their manufacture are disclosed. A microelectronic element may include a substrate including an opening extending through a semiconductor region of the substrate, a dielectric layer cover a wall of the opening within at least a first portion of the opening, a first metal disposed within the first portion of the opening, a second metal disposed within a second portion of the opening. The second metal may form at least part of a contact of the microelectronic element.

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Patent Owner(s)

  • INVENSAS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ayatollahi, Fatima Lina Fremont, US 5 18
Haba, Belgacem Saratoga, US 716 20639
Monadgemi, Pezhman Fremont, US 43 1081
Newman, Michael Dublin, US 67 1718

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