DEVICES AND METHODS FOR STACKING INDIVIDUALLY TESTED DEVICES TO FORM MULTI-CHIP ELECTRONIC MODULES
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United States of America Patent
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Issued Date -
Jun 26, 2014
app pub date -
Feb 27, 2014
filing date -
Jun 22, 2011
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Abandoned
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Abstract
A method for manufacturing an electronic multi-chip module that involves stacking at least six tested devices to form the module. These devices may be individually tested prior to assembling the electronic module. After individually testing the devices, the devices may be stacked one on top of the other to form an electronic multi-chip module having at least six stacked devices. Other embodiments may be described and claimed.
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