High bandwidth differential lead with device connection
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United States of America Patent
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Nov 1, 2016
Grant Date -
Jun 26, 2014
app pub date -
Dec 21, 2012
filing date -
Dec 21, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
A high bandwidth solder-less lead may be connected to an electrical device having land patterns so that signals on the device may be more easily measured through the lead. The lead includes an attachment mechanism to mount the lead on the device, a microspring housing and at least one microspring. The microspring connects one of the particular land patterns on the device to the lead where it may be easier to couple to a measurement device than to the electrical device itself. The lead may be coupled to a flexible electrical conduit to make attaching to the testing device even easier. In other versions, a uniform connector may be temporarily attached to the solder-less lead to test the device. Then the connector may be disconnected from the first lead and connected to another lead to test another area of the device.
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