PACKAGE-LEVEL INTEGRATED CIRCUIT CONNECTION WITHOUT TOP METAL PADS OR BONDING WIRE

United States of America Patent

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Issued Date
Jun 26, 2014
app pub date
Feb 28, 2014
filing date
Aug 17, 2009

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Abandoned

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Abstract

An integrated circuit method is provided with package-level connectivity, between internal electronic circuitry thereof and contact points on a package substrate thereof, without requiring top metal pads or bonding wires.

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Patent Owner(s)

Patent Owner	Address
MOSAID TECHNOLOGIES INCORPORATED	OTTAWA

International Classification(s)

H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
PYEON, Hong Beom	Kanata, CA	161	2697

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PACKAGE-LEVEL INTEGRATED CIRCUIT CONNECTION WITHOUT TOP METAL PADS OR BONDING WIRE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

14193436

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14193436

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