Method of thinning a wafer to provide a raised peripheral edge
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United States of America Patent
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Aug 18, 2015
Grant Date -
Jun 26, 2014
app pub date -
Dec 20, 2012
filing date -
Dec 20, 2012
priority date (Note) -
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Abstract
A first area of a first surface of an encapsulated component can be thinned, the component including: a semiconductor chip having an active surface opposite the first surface, and an encapsulant extending outwardly from edges of the semiconductor chip. An entire area of the active surface may be aligned with the first area. After the abrading, a second area of the encapsulated component beyond the first area may have a thickness greater than a thickness of the first area. The second area can be configured to fully support the abraded encapsulated component in a state of the encapsulated component being manipulated by handling equipment.
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