RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jul 3, 2014
app pub date -
Dec 18, 2013
filing date -
Dec 28, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A rigid-flexible printed circuit board includes a first circuit substrate, a third circuit substrate, and an adhesive sheet sandwiched between the first circuit substrate and the third circuit substrate. The first circuit substrate is a rigid circuit substrate. The third circuit substrate is a flexible circuit substrate, and includes an exposed area and two lamination areas. The exposed area is sandwiched between the two lamination areas. The first circuit substrate and the adhesive sheet are only laminated onto the two lamination areas. A dielectric layer of the first circuit substrate is a rigid epoxy glass cloth laminate, and a dielectric layer of the third circuit substrate is a flexible epoxy glass cloth laminate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully