PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Jul 3, 2014
app pub date -
Jun 27, 2013
filing date -
Dec 27, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board including an adhesive promoter interposed between an insulating layer and a circuit layer on a substrate in order to improve adhesion therebetween; and a first metal layer formed between the adhesive promoter and the circuit layer has high adhesion between an insulating layer such as a resin and a circuit while having low roughness by including a polymer adhesive promoter, easily forms a fine circuit and has low signal transmission loss due to low roughness, and has high reliability due to the high adhesion.
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