SPUTTERING APPARATUS AND METHOD FOR FORMING THIN FILM
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United States of America Patent
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app pub date -
Jan 24, 2014
filing date -
Jun 1, 2007
priority date (Note) -
Abandoned
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Abstract
A sputtering method uses a sputtering apparatus for forming a thin film, the sputtering apparatus comprising a pair of facing polygonal prism target holders in which a target is placed on each surface parallel to a rotation axis of a rotatable polygonal prism body. A magnetic pole group including a plurality of magnets is disposed on a back surface of each of the targets, and each of the magnetic pole groups includes magnets or yokes of different magnetic pole directions. The magnets or yokes on the back surface of each of the targets are disposed so that adjacent magnets or yokes become alternately different magnetic pole direction, and the magnets or yokes disposed on the back surfaces of the targets have polarities opposite to each other.
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