SEMICONDUCTOR ASSEMBLY WITH BUILT-IN STOPPER, SEMICONDUCTOR DEVICE AND BUILD-UP CIRCUITRY AND METHOD OF MAKING THE SAME
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United States of America Patent
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Issued Date -
Jul 3, 2014
app pub date -
Jan 3, 2013
filing date -
Jan 3, 2013
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a semiconductor assembly with a built-in stopper and a method of making the same. In accordance with one preferred embodiment of the present invention, the method includes: forming a stopper on a dielectric layer; mounting a semiconductor device on the dielectric layer using the stopper as a placement guide for the semiconductor device; attaching a stiffener to the dielectric layer; and forming a build-up circuitry that covers the semiconductor device, the stopper and the stiffener and provides signal routing for the semiconductor device. Accordingly, the stopper can accurately confine the placement location of the semiconductor device and avoid the electrical connection failure between the semiconductor device and the build-up circuitry.
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