Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip
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United States of America Patent
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Feb 23, 2016
Grant Date -
Jul 3, 2014
app pub date -
Mar 7, 2014
filing date -
Dec 10, 2009
priority date (Note) -
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Abstract
Disclosed is a chip and method of forming the chip with improved conductive pads that allow for flexible C4 connections with a chip carrier or with another integrated circuit chip. The pads have a three-dimensional geometric shape (e.g., a pyramid or cone shape) with a base adjacent to the surface of the chip, a vertex opposite the base and, optionally, mushroom-shaped cap atop the vertex. Each pad can include a single layer of conductive material or multiple layers of conductive material (e.g., a wetting layer stacked above a non-wetting layer). The pads can be left exposed to allow for subsequent connection to corresponding solder bumps on a chip carrier or a second chip. Alternatively, solder balls can be positioned on the conductive pads to allow for subsequent connection to corresponding solder-paste filled openings on a chip carrier or a second chip.
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