Modular Multiple Piece Socket For Enhanced Thermal Management
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United States of America Patent
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Issued Date -
Jul 3, 2014
app pub date -
Dec 27, 2012
filing date -
Dec 27, 2012
priority date (Note) -
Abandoned
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Abstract
A modular multiple piece socket and a computing system are described herein. The modular multiple piece socket includes a plurality of socket pieces, wherein at least one corridor separates the socket pieces. The plurality of socket pieces may be configured to secure a processing unit to a printed circuit board. The at least one corridor may be filled with a thermally conductive material.
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