Method for reducing damage by harmful organisms in corn cultivation

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United States of America Patent

PATENT NO 9629371
SERIAL NO

14109295

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Abstract

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Provided is a method for reducing damage by harmful organisms in corn cultivation. Damage by harmful organisms in corn cultivation can be reduced by carrying out the steps of: A) making a furrow in a cultivated land; B) seeding corn into the furrow formed in the foregoing step; C) applying to the furrow one or more selected from the below-mentioned compound group (I) and chlorpyrifos; and D) closing the furrow. compound group (I): group consisting of clothianidin, thiamethoxam, imidacloprid and thiacloprid.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO CHEMICAL COMPANY LIMITEDCHUO-KU TOKYO 104-8260

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sakamoto, Norihisa Kasai, JP 23 57
Shimokawatoko, Yasutaka Takarazuka, JP 17 7
Tanaka, Azusa Takarazuka, JP 4 11

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