Metal to metal bonding for stacked (3D) integrated circuits

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United States of America Patent

PATENT NO 8916448
SERIAL NO

13736984

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Abstract

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The present invention provides a stabilized fine textured metal microstructure that constitutes a durable activated surface usable for bonding a 3D stacked chip. A fine-grain layer that resists self anneal enables metal to metal bonding at moderate time and temperature and wider process flexibility.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Tien-Jen Bedford, US 38 305
Farooq, Mukta G Hopewell Junction, US 212 3354
Fitzsimmons, John A Poughkeepsie, US 114 1315

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