Embedded package in PCB build up
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United States of America Patent
Stats
-
Dec 1, 2015
Grant Date -
Jul 10, 2014
app pub date -
Jan 7, 2013
filing date -
Jan 7, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An apparatus including a printed circuit board including a body of a plurality of alternating layers of conductive material and insulating material; and a package including a die disposed within the body of the printed circuit board. A method including forming a printed circuit board including a core and a build-up section including alternating layers of conductive material and insulating material coupled to the core; and coupling a package including a die to the core of the printed circuit board such that at least a portion of a sidewall of the package is embedded in at least a portion of the build-up section. An apparatus including a printed circuit board including a body; a computing device including a package including a microprocessor disposed within the body of the printed circuit board; and a peripheral device that provides input or output to the computing device.
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