SEMICONDUCTOR DEVICE AND PRINTED CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Jul 10, 2014
app pub date -
Sep 13, 2012
filing date -
Sep 14, 2011
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Abstract
Provided is a compact semiconductor device having high joint reliability of multiple first ball electrodes arrayed on one surface of a first interposer. On a surface (233a) of a second interposer (233) facing a first interposer (213), second ball electrodes (235) are arranged at grid points at which multiple first straight lines extending in one direction are intersected with multiple second straight lines extending in a direction different from the multiple first straight lines. Corner grid points closest to the corners of the second interposer (233) are set as non-joint grid points at which the first and second interposers (213, 233) are not joined to each other.
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