Substrate processing method and substrate processing apparatus
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United States of America Patent
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Jul 5, 2016
Grant Date -
Jul 17, 2014
app pub date -
Jan 2, 2014
filing date -
Jan 15, 2013
priority date (Note) -
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Abstract
Scan step (S3) for moving a nozzle with etching liquid discharged therefrom is carried out such that etching liquid application position toward the rotating substrate moves from the edge portion toward the center portion of the principal face of the substrate. Thereafter, center discharging step (S4) for continuing the supply of the etching liquid toward the principal face of the substrate under the condition that the application position is positioned at the center portion of the principal face of the substrate W is conducted. Moving velocity of the liquid application position in the scan step (S3) is determined in accordance with supply condition of the etching liquid toward the substrate under the condition that the liquid application position is positioned at the center portion of the principal face of the substrate.
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