Extended redistribution layers bumped wafer
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United States of America Patent
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-
Aug 2, 2016
Grant Date -
Jul 17, 2014
app pub date -
Mar 14, 2014
filing date -
May 4, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device is manufactured by, first, providing a wafer, designated with a saw street guide, and having a bond pad formed on an active surface of the wafer. The wafer is taped with a dicing tape. The wafer is singulated along the saw street guide into a plurality of dies having a plurality of gaps between each of the plurality of dies. The dicing tape is stretched to expand the plurality of gaps to a predetermined distance. An organic material is deposited into each of the plurality of gaps. A top surface of the organic material is substantially coplanar with a top surface of a first die of the plurality of dies. A redistribution layer is patterned over a portion of the organic material. An under bump metallization (UBM) is deposited over the organic material in electrical communication, through the redistribution layer, with the bond pad.
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