Integrated circuit packaging system with molded grid-array mechanism and method of manufacture thereof
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United States of America Patent
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Mar 24, 2015
Grant Date -
Jul 17, 2014
app pub date -
Jan 11, 2013
filing date -
Jan 11, 2013
priority date (Note) -
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a lead-frame having a metal connector mounted thereon and having a peripheral mounting region; forming an insulation cover on the lead-frame and on the metal connector; connecting an integrated circuit die over the insulation cover; forming a top encapsulation on the integrated circuit die with the peripheral mounting region exposed from the top encapsulation; forming a routing layer, having a conductive land, from the lead-frame; and forming a bottom encapsulation partially encapsulating the routing layer and the insulation cover.
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