STACKED PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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-
N/A
Issued Date -
Jul 17, 2014
app pub date -
Apr 22, 2013
filing date -
Jan 11, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A stacked package device includes a substrate, at least one electronic component and a molding unit. The molding unit includes a first insulation layer, a second insulation layer, and a first shielding layer. The electronic component is disposed on the substrate. The first insulation layer is disposed on the substrate and covers the electronic component. The first insulation layer has a plurality of holes, and is disposed on the first insulation layer. The second insulation layer is disposed on the first shielding layer. The first insulation layer is connected to the second insulation layer through the holes.
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