Defect pattern evaluation method, defect pattern evaluation apparatus, and recording media

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United States of America Patent

PATENT NO 9202763
APP PUB NO 20140199792A1
SERIAL NO

13829200

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Abstract

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According to a defect pattern evaluation method of an embodiment, defects are detected by performing optical defect inspection on a pattern on a substrate. Then, the defects are classified according to a type of a pattern layout using a pattern layout corresponding to coordinates of the defects. Further, a computer calculates a defect occurrence rate by dividing the number of defects of each pattern layout by an arrangement number of the pattern layouts in an inspection region. Then, the defect occurrence rate of each pattern layout is output as an evaluation result.

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Patent Owner(s)

  • TOSHIBA MEMORY CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aritake, Toshiyuki Mie, JP 8 117
Miyoshi, Seiro Mie, JP 24 356

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