PLASMA HEAT TREATMENT APPARATUS

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United States of America Patent

APP PUB NO 20140202995A1
SERIAL NO

13956492

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A plasma heat treatment apparatus, provided for enabling a control of temperature distribution within electrode surfaces, without accompanying an increase of an electric power to be inputted therein, even in case when heating is made on a sample to be heated, having a large diameter thereof, with applying plasma, comprises a treatment chamber 100 for heat the sample 101 to be treated therein, a first electrode 102, which is disposed within the treatment chamber, a plate-shaped second electrode 103, which is disposed opposing to the first electrode 102, a radio-frequency power supply 111 for supplying radio-frequency electric power to the first electrode 102 or the second electrode 103, and a gas introducing means 113 for supplying a gas within the treatment chamber, wherein the first electrode 102 has an opening portion therein.

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Patent Owner(s)

Patent OwnerAddress
HITACHI HIGH-TECH CORPORATION17-1 TORANOMON 1-CHOME MINATO-KU TOKYO 105-6409

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KAWASAKI, Hiromichi Tokyo, JP 16 41
MIYAKE, Masatoshi Tokyo, JP 31 213
UEMURA, Takashi Tokyo, JP 65 630
YOKOGAWA, Ken'etsu Tokyo, JP 23 351

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