Semiconductor device and manufacturing method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9224713
APP PUB NO 20140206144A1
SERIAL NO

14221838

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Abstract

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In one embodiment, a semiconductor device includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first and second semiconductor chips are electrically connected via first bump connection parts. Stopper projections and bonding projections are provided at least one of the first and second semiconductor chips. The stopper projections are in contact with the other of the first and second semiconductor chips in an unbonded state. The bonding projections are bonded to the first and second semiconductor chips.

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Patent Owner(s)

  • TOSHIBA MEMORY CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukuda, Masatoshi Yokohama, JP 74 1578
Komuta, Naoyuki Oita, JP 16 190
Mizoguchi, Keita Yokohama, JP 3 20
Tsukiyama, Satoshi Yokohama, JP 26 136
Watabe, Hiroshi Hino, JP 25 273

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