METHODS OF FORMING A PORUOUS INSULATOR, AND RELATED METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURES
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United States of America Patent
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Mar 21, 2014
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Aug 29, 2002
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Abstract
Semiconductor devices with porous insulative materials are disclosed. The porous insulative materials may include a consolidated material with voids dispersed therethrough. The voids may be defined by shells of microcapsules. The voids impart the dielectric materials with reduced dielectric constants and, thus, increased electrical insulation properties.
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