POLISHING APPARATUS AND METHOD OF POLISHING SEMICONDUCTOR WAFER
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jul 24, 2014
app pub date -
Sep 5, 2013
filing date -
Jan 22, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An aspect of the present embodiment, there is provided a polishing apparatus, including a stage configured to be placed a semiconductor wafer thereon and to be rotated with the semiconductor wafer, a first polishing unit configured to contact a polishing tape to one portion of the semiconductor wafer on the stage, a second polishing unit configured to contact to other portion of the semiconductor wafer, the other portion being different from the one portion, a feed unit configured to feeding the polishing tape, and a recovery unit configured to recovery the polishing tape.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully