WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
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United States of America Patent
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N/A
Issued Date -
Jul 31, 2014
app pub date -
Jan 9, 2014
filing date -
Jan 31, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A wiring board according to the present invention has an insulating board 1 including a land conductor layer 14 on a surface thereof; an insulating layer 5 formed on the insulating board 1; a via hole 6 extending from an upper surface of the insulating layer 5 to the land conductor layer 14; a via conductor 7 formed in the via hole 6 and formed of a plated metal layer; and a wiring conductor 3b formed on the via conductor 7 and electrically connected to the via conductor 7, wherein the via hole 6 is provided with a protruding portion 8a formed of copper foil and protruding from a periphery of an opening of the via hole 6 toward a center of the opening.
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