Circuit Board Assembly

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20140211421A1
SERIAL NO

13752584

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A circuit board assembly includes first and second circuit boards that each have a substrate and a conductive circuit layer positioned on the substrate. The first and second circuit boards are arranged such that the conductive circuit layers face each other across a gap. Thermal conductor pillars extend lengths across the gap between the conductive circuit layers of the first and second circuit boards. The thermal conductor pillars include opposite first and second ends that are engaged in thermal contact with the conductive circuit layers of the first and second circuit boards, respectively. The thermal conductor pillars provide thermal pathways for heat to travel between the first and second circuit boards.

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Patent Owner(s)

Patent OwnerAddress
TE CONNECTIVITY CORPORATION1050 WESTLAKES DRIVE BERWYN PA 19312

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Conway, Bruce R La Honda, US 20 217
Dutton, Peter J Fremont, US 12 43
Mishrikey, Matthew D Oakland, US 2 15
O'Keeffe, James Newark, US 7 97

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