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Abstract

Several embodiments of a metallization process are disclosed, which achieve lower contact resistance and higher conductivity than methods currently employed with solar cells. These parameters result in a solar cell having improved performance and efficiency. In one embodiment, two different metals are used to create the metallization layer, where the first metal is selected for superior ohmic contact to the substrate and the second metal is selected based on conductivity. In a second embodiment, a first metal is evaporated or sputtered on the substrate. A second metal is then screen printed on the substrate. A removal step, such as etching is then performed to remove unwanted metal from the substrate.

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First Claim