Importance

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Abstract

A method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof comprises the following steps:

providing a layer of rigid insulating materialremoving at least one area of the rigid insulating materialinserting a flexible insulating material into the removed or cut-out area(s) of the rigid insulating materialcovering the rigid and flexible insulating material with a layer of conductive material on at least one surfacebuilding up at least one further layer of the rigid-flex printed circuit board at least on the rigid part(s) of the insulating material,wherein the at least one further layer of the rigid-flex printed circuit board is partly overlapping the flexible area(s) of the insulating material.

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First Claim