Low profile zero/low insertion force package top side flex cable connector architecture
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United States of America Patent
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Apr 26, 2016
Grant Date -
Aug 7, 2014
app pub date -
Dec 20, 2011
filing date -
Dec 20, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
An integrated circuit package is presented. In an embodiment, the integrated circuit package has contact pads formed on the top side of a package substrate, a die electrically attached to the contact pads, and input/output (I/O) pads formed on the top side of the package substrate. The I/O pads are electrically connected to the contact pads. The integrated circuit package also includes a flex cable receptacle electrically connected to the I/O pads on the top side of the package substrate. The flex cable receptacle is non-compressively attachable to a flex cable connector and includes receptacle connection pins electrically connected to the I/O pads.
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