SEMICONDUCTOR MODULE, CIRCUIT BOARD

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United States of America Patent

APP PUB NO 20140217608A1
SERIAL NO

14239479

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An improvement in the manufacturing efficiency of a circuit substrate and a semiconductor module where a semiconductor device including electrodes on a front and a back surface is mounted.

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Patent Owner(s)

Patent OwnerAddress
NGK SPARK PLUG CO LTDNAGOYA PREFECTURE AICHI PREFECTURE JAPAN NAGOYA CITY AICHI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Takayama, Yasushi Niwa-gun, JP 14 34

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